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Copper Desoldering Braid / Solder Wick (1.5 m)
High-quality desoldering braid designed for fast, clean, and safe removal of solder residues from PCBs, BGA components, and electronic parts. Featuring a flat woven copper design and special flux impregnation, it provides superior capillary action for ultra-fast solder absorption.
Main Advantages:
- High Absorption: Instant solder intake thanks to copper's excellent thermal conductivity, protecting the board from thermal damage or pad lifting.
- Low Residue: The special impregnation leaves minimal traces, keeping the work area clean and reducing the need for post-repair washing.
- Corrosion Protection: Oxidation-resistant braid ensures a long shelf life without losing its absorbent properties.
- Safe Dispenser: The compact plastic spool protects the braid from moisture and allows for safe handling, preventing finger burns during use.
Available Modifications:
- 2.0 mm (CP-2015): For small SMD components and dense mounting.
- 2.5 mm (CP-2515): Universal size for most standard tasks.
- 3.0 mm (CP-3015): For medium contacts and IC pins.
- 3.5 mm (CP-3515): For large areas and BGA pad cleaning.
Technical Specifications:
- Material: Pure Copper
- Length: 1.5 m
- Braid Type: Flat Braid
- Spool Dimensions: 50 x 50 x 15 mm